XCVM1302-2HSIVSVD1760 Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA

XCVM1302-2HSIVSVD1760 Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA

Mfr:AMD Xilinx

Part Number:XCVM1302-2HSIVSVD1760

Description:XCVM1302-2HSIVSVD1760 IC VERSALPRIME ACAP FPGA 1760BGA

Category Integrated Circuits (ICs) Embedded System On Chip (SoC)

Series:Zynq® UltraScale+™

Package:Tray

Product Status:Active

Architecture:MPU, FPGA

Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

RAM Size:256KB

Peripherals:DMA, WDT

Speed:667MHz

Operating Temperature:-40°C ~ 100°C (TJ)

Package / Case:784-BFBGA, FCBGA

Supplier Device Package:784-FCBGA (23x23)

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